Bondada Engineering Ltd. IPO

Bondada Engineering Ltd. is listed in the SME segment. The figures below are as reported by the exchanges and public sources.

Bondada Engineering Ltd. IPO — key facts

• As of 5 September 2026, the Bondada Engineering Ltd. IPO subscription status is 112.28x overall.
• The issue is open from 18-Aug-2023 to 22-Aug-2023.
• Bondada Engineering Ltd. listed on 30-Aug-2023.
• Bondada Engineering Ltd. listed at ₹149.62. The listing gain was 99.5% against the upper end of the issue price band.

Bondada Engineering Ltd. IPO details

Status

Listed

Segment

SME

Sector

Telecom - Infrastructure

Price

₹75

Issue size

₹42.72 Cr

Fresh issue

₹40.56 Cr

Opens

18-Aug-2023

Closes

22-Aug-2023

Listing

30-Aug-2023

Total subscription

112.28x

Retail

100.05x

NII

115.46x

Lead managers

Vivro Financial

Listing price

₹149.62

Listing day change

+99.5%

Other Telecom - Infrastructure IPOs

• Pace Digitek Limited -0.7% on listing
• Rama Telecom Limited +0.6% on listing
• SAR Televenture Limited +100.5% on listing
• Kore Digital Limited +6.1% on listing
• Suyog Telematics Ltd. +1.0% on listing
• Bharti Infratel Ltd. -12.9% on listing

Live subscription, allotment status, offer documents and the full lifecycle timeline for this issue are on this page. Historical listing performance for every past IPO is in the IPO database, and each day's activity is recorded in the daily digest.

Published by INVESTOLOGY — SEBI Registered Research Analyst INH000015297. Data is reported for information only. It is not research and not investment advice. Investments in securities markets are subject to market risk; read all offer documents carefully before investing.